MAIN PRODUCTS:
* Bonding gold boards.
* High density, fine line boards.
* Conventional single side boards.
* Conventional double-sided boards.
* Conventional multi-layers boards (4-6 layers).
* SMT boards.

MANUFACTURING PROCESSES:
* Nickel and gold plating.
* Hot air leveling.
* Dry film and photo liquid-resistant solder mask.
Fabrication Capability:
* Punching.
* V-cut.
* CNC routing.
* Push back.

GENERAL SPECIFICATIONS:
* IPC-A-600D
* MIL-STD-105D
* Customer's specification.
Production Capacity:
* Multi-layers 30,000 square foot/Month.
* Double-sided 120,000 square foot/Month.
* Single-side 100,000 square foot/Month.